Honor is all set to unveil its next-generation folding smartphone dubbed Honor Magic V3. The company is holding an official launch event on July 12, where this smartphone will be announced along with some other Honor products. We have already seen some official teasers from the company revealing the design of Magic V3. Now we have a more precise look because real-life images have been leaked showing the full design of this device on the Chinese microblogging website Weibo.
Looking at the images, the smartphone looks nearly identical to its predecessor with a hole-punch camera and a big screen. It looks like the same display we have seen previously on the Magic V2 combined with a cover display. But there are measurable chances at the rear side of the device. This time, we have an octagonal camera island, which brings a triple rear camera setup.
However, Magic V2 also fetched a triple camera, but that was placed vertically instead of circular design. The “Honor” badging is engraved at the center of the bottom, which is also relocated from the bottom right. From the design perspective, Honor Magic V3 has some notable changes in comparison to Magic V2.
Regarding the specification, Honor Magic V3 is expected to bring the latest Qualcomm Snapdragon 8 Gen 3 chipset under the hood. It will have a 50MP “Eagle Eye” primary camera + a periscope lens with 3.5x optical zoom. For connectivity, it comes with 5.5G satellite communication support for the Chinese variant.
In a separate leak, we learned that the Honor Magic V3 packs a 5150 mAh (typical) battery capacity, supported by 66W wired charging. There are multiple memory options 256/512GB, and 1TB storage, which are likely to be combined with at least 16GB RAM. It accumulates a side-mounted fingerprint sensor, similar to the Honor Magic V2. Besides, the smartphone will be thinner than the Honor Magic V2 (9.9mm), which has already been confirmed by the company. Lastly, it will be available in multiple color options; Orange, Green, White, and Black.
